Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /
Saved in:
| Hovedforfatter: | Chen, Wei Keat (Author) |
|---|---|
| Format: | Software eBog |
| Sprog: | English |
| Udgivet: |
2014.
|
| Fag: | |
| Tags: |
Tilføj Tag
Ingen Tags, Vær først til at tagge denne postø!
|
Lignende værker
-
Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /
af: Chen, Wei Keat
Udgivet: (2014) -
The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Udgivet: (2011) -
The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Udgivet: (2011) -
Solders and soldering materials, design, production, and analysis for reliable bonding
af: Manko, Howard H.
Udgivet: (2001) -
Solders and soldering materials, design, production, and analysis for reliable bonding
af: Manko, Howard H.
Udgivet: (2001)