Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /
Saved in:
Main Author: | Chen, Wei Keat (Author) |
---|---|
Format: | Software eBook |
Language: | English |
Published: |
2014.
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /
by: Chen, Wei Keat
Published: (2014) -
The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Published: (2011) -
The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Published: (2011) -
Solders and soldering materials, design, production, and analysis for reliable bonding
by: Manko, Howard H.
Published: (2001) -
Solders and soldering materials, design, production, and analysis for reliable bonding
by: Manko, Howard H.
Published: (2001)