Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /

Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /

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Detalles Bibliográficos
Autor Principal: Chen, Wei Keat (Author)
Formato: Software eBook
Idioma:English
Publicado: 2014.
Subjects:
Solder and soldering.
Surfaces (Technology) > Analysis.
Metals > Surfaces > Testing.
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