Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2016
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| LEADER | 01367pam a2200313 4500 | ||
|---|---|---|---|
| 001 | 0000105488 | ||
| 008 | 170906s2016 my eng | ||
| 020 | |c gift | ||
| 040 | |a UTeM |b eng |e rda | ||
| 090 | 0 | 0 | |a TK7868.P7 |b .L55 2016 |
| 100 | 1 | |a Lim, Kean Teik |e author. |9 49143 | |
| 245 | 1 | 0 | |a Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique |c /Lim Kean Teik. |
| 264 | 1 | |c 2016 | |
| 300 | |a xii, 94 pages |b some colour illustrations, charts, photographs |c 30 cm | ||
| 336 | |a still image |2 rdacontent | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |a Thesis (Master of Manufacturing Engineering : Manufacturing Systems Engineering) |c Universiti Teknikal Malaysia Melaka |d 2016 | ||
| 504 | |a Reference : pages 90-94. | ||
| 650 | 0 | |a Six sigma (Quality control standard). |9 2504 | |
| 650 | 0 | |a Solder paste. |9 49144 | |
| 650 | 0 | |a Printed circuit. |9 49145 | |
| 650 | 0 | |a Surface mount technology. |9 42535 | |
| 710 | 2 | |a Universiti Teknikal Malaysia Melaka. |b Faculty of Manufacturing Engineering |e institution |9 235 | |
| 998 | 0 | 0 | |a mez/260917 |
| 999 | |c 104960 |d 104960 | ||
| 997 | |a FKP | ||
| 952 | |0 0 |1 0 |2 lcc |4 0 |6 TK7868 P7 L55 02016 |7 0 |9 130820 |a PLHKI |b PLHKI |c Archives |d 2019-02-26 |e UTEM |g 0.00 |l 0 |o TK7868 P7 L55 2016 |p 0000130782 |r 2017-11-06 |s 2017-11-06 |w 2019-02-26 |y THM - A | ||