IC component sockets /

IC component sockets /

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Xehetasun bibliografikoak
Egile nagusia:	Lui, Weifeng (Egilea)
Beste egile batzuk:	Pecht, Michael
Formatua:	Liburua
Hizkuntza:	English
Argitaratua:	Hoboken, NJ : John Wiley, 2004.
Gaiak:	Printed circuits > Equipment and supplies. Electric connectors. Microelectronic packaging.
Etiketak:	Etiketa erantsi Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!

Antzeko izenburuak

IC component sockets /
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Advanced electronic packaging /
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Electronic connector handbook : theory and applications /
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Conductors /
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Conduit
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Terminations and splices /
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Electrical plugs and wiring and world electricity supplies.
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Materials for advanced packaging /
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Hermeticity testing of MEMS and microelectronic packages /
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MEMS/MOEMS packaging : concepts, designs, materials and processes /
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Physical design essentials : an ASIC design implementation perspective /
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Force sensors for microelectronic packaging applications /
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MEMS and microsystems : design, manufacture and nanoscale engineering /
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Reliability of electronic packages and semiconductor devices /
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Introduction to system-on-package (SOP) : miniaturization of the entire system /
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Advanced electronic packaging : with emphasis on multichip modules /
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Area array packing handbook : manufacturing and assembly /
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Microvias : for low-cost, high-density interconnects /
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Integrated circuit packaging, assembly and interconnections /
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Electronic connector handbook : theory and applications /
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Foldable flex and thinned silicon multichip packaging technology /
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3D IC stacking technology /
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Fundamentals of microsystems packaging /
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Specification for screwed and socketed steel tubes and tubulars and for plain end steel tubes suitable for welding or for screwing to BS 21 pipe threads.
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Quantum-well laser array packaging : nanoscale packaging techniques /
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Package printing /
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Specification for 13A plugs, socket-outlets, adaptors and connection units part 2 : specification for 13A switched and unswitched socket-outlet (First revision)
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Specification for 13A plugs, socket-outlets, adaptors and connection units part 2 : specification for 13A switched and unswitched socket-outlet (First revision)
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Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics /
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Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics /
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3D IC stacking technology
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3D IC stacking technology
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Effect of pad roughness on shear strength of thin small leadless package /
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Computer vision inspection and classification on printed circuit boards for flux defects /
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Computer vision inspection and classification on printed circuit boards for flux defects /
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Effect of pad roughness on shear strength of thin small leadless package /
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Merekabentuk papan litar bercetak /
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Design of a PCB diagnostic system /
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Analisis terhadap produk 3DP bagi menggantikan aluminium sebagai pemegang printed circuit board (PCB) /
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Pembentukan whisker pada kemasan permukaan rendaman timah /
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