Stress analysis of airship's envelope, gondala and fin structures using FEM software /

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Bibliographic Details
Main Author: Loke, Chai Yee (Author)
Corporate Author: Kolej Universiti Teknologi Tun Hussein Onn. Fakulti Kejuruteraan Mekanikal dan Pembuatan
Format: Thesis Book
Language:English
Published: Batu Pahat : Kolej Universiti Teknologi Tun Hussein Onn, 2006.
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