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  1. 1
    Mata wang syiling Malaysia-metalurgi dua dasawarsa /
    per Mohd Adam Mohd Sidek
    Publicat 2011
    Thesis Llibre
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  2. 2
    Kajian sifat mekanik dan minrostruktur tiub tembaga dan tiub dwilogam aluminium-tembaga /
    per Muhammad Faisal Mahmod
    Publicat 2012
    Thesis Llibre
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  3. 3
    Prion diseases and copper metabolism : BSE, scrapie, and CJD research /
    per Brown, David R.
    Publicat 2002
    Llibre
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  4. 4
    Copper-fundamental mechanisms for microelectronic applications /
    per Murarka, Shyam P.
    Publicat 2000
    Llibre
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  5. 5
    Mata wang syiling Malaysia - perbandingan fizikal, mekanik dan metalurgi mengikut siri keluaran /
    per Mohamad Sofi Jusoh
    Publicat 2014
    Thesis Llibre
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  6. 6
    Vibration detection on CNC lathe tool using ANOVA method for copper and mild steel /
    per Nurul Ain Miftah
    Publicat 2014
    Thesis Llibre
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  7. 7
    Copper interconnect technology
    per Gupta, Tapan
    Publicat 2009
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    eBook
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  8. 8
    Study on forming parameter in single point incrementel forming of copper plate /
    per Akmal Ishak
    Publicat 2014
    Thesis Llibre
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  9. 9
    Kajian kuprum diperkuat dengan tungsten karbida untuk aplikasi elektrod kimpalan bintik /
    per Shamsun Zakaria
    Publicat 2005
    Thesis Llibre
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  10. 10
    Multi roller burnishing of copper alloy and their mechanical characteristics using milling machine /
    per Muhammad Akmal Mat Husin
    Publicat 2014
    Thesis Llibre
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  11. 11
    Study on copper incorporated mesoporous silica SBA-15 for N2O catalytic decomposition /
    per Mohd Haizal Mohd Husin
    Publicat 2016
    Software eBook
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  12. 12
    Development on copper to copper bonding optimization on low-k structure integrated circuit device
    per Chan, Swee Guan
    Publicat 2016
    Thesis Llibre
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  13. 13
    Interactives arts using circuit paper with alarm system based on internet of things (IoT) /
    per Nur Farhana Mohd Amin
    Publicat 2017
    Software eBook
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  14. 14
    Electrical waste copper wire separator machine
    per Noor Rafida Mohd Sagik
    Publicat 2017
    Thesis Llibre
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  15. 15
    The process optimization for annealing and oxide-free copper using N2H2 gas /
    per Muhammad Firdaus Jais
    Publicat 2018
    Software eBook
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  16. 16
    The effect of oxide layer to copper pad for electronic packaging application /
    per Muhammad Firdaus Sulaiman
    Publicat 2018
    Software eBook
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  17. 17
    The effect of oxide layer to copper pad for electronic packaging application /
    per Muhammad Firdaus Sulaiman
    Publicat 2018
    Software eBook
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  18. 18
    The effect of copper (Cu) electroplating parameters on copper Vertical Interconnect Access (VIA) filling for Printed Circuit Board (PCB) /
    per Nor Aqilah Yuza
    Publicat 2019
    Software eBook
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  19. 19
    Process-properties effect on copper alloy after investment casting using ABS material as pattern /
    Software eBook
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  20. 20
    Design suitable earthing system with different type of rod and soil condition /
    per Lim, Li Meng
    Publicat 2019
    Software eBook
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