Flexible printed circuitry /

по Stearns, Thomas H.
Опубликовано 1996

Foldable flex and thinned silicon multichip packaging technology /

Опубликовано 2003

Flexible printed circuitry /

по Stearns, Thomas H.
Опубликовано 1996

Flexible electronics materials and applications

Опубликовано 2009

Elimination of gold tarnish by post dip after gold plating process in flexible printed circuit board manufacturing /

по Umadewi Ganasan
Опубликовано 2018

Characterization of adhesive layer of laminating pressed flexible printed circuit panel /

по Kok, Hoi Ern
Опубликовано 2019

Effect of different inkjet print parameter on quality labelling for different flexible printed circuit board materials /

по Noor Farah Izzati Che Jusoh
Опубликовано 2020

An investigation of superhydrophobic waterproofing for electronic assembly /

по Ghazali Omar, Professor Dr. author, Zambri Samsudin, Mohd Nur Azmi Nordin, Dr, Anita Akmar Kamarolzaman, Mohd Azli Salim, Ts. Dr, Muhd Ridzuan Mansor, Dr, Wu, Jonathan Wei Ping
Опубликовано 2019

Flexible printed circuit board inkjet labelling readability via 3D laser microscopy at MFS Technology Sdn Bhd /

по Hamizah Hayat
Опубликовано 2020

Flexible electronics materials and applications

Опубликовано 2009

Flexible printed circuitry /

по Stearns, Thomas H.
Опубликовано 1996

Flexible solar cells /

по Pagliaro, Mario
Опубликовано 2008

The printability of the conductive polymer epoxy onto the pet flexible substrate /

по Tan, Yan Hau
Опубликовано 2019

Flexible solar cells /

по Pagliaro, Mario
Опубликовано 2008

Flexible printed circuitry

по Stearns, Thomas H.
Опубликовано 1996

Elimination of gold tarnish by post dip after gold plating process in flexible printed circuit board manufacturing /

по Umadewi Ganasan
Опубликовано 2018

The printability of the conductive polymer epoxy onto the pet flexible substrate /

по Tan, Yan Hau
Опубликовано 2019

Characterization of adhesive layer of laminating pressed flexible printed circuit panel /

по Kok, Hoi Ern
Опубликовано 2019

Effect of different inkjet print parameter on quality labelling for different flexible printed circuit board materials /

по Noor Farah Izzati Che Jusoh
Опубликовано 2020

An investigation of superhydrophobic waterproofing for electronic assembly /

по Ghazali Omar, Professor Dr. author, Zambri Samsudin, Mohd Nur Azmi Nordin, Dr, Anita Akmar Kamarolzaman, Mohd Azli Salim, Ts. Dr, Muhd Ridzuan Mansor, Dr, Wu, Jonathan Wei Ping
Опубликовано 2019