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  1. 1
    Stesen mini pematerian bercirikan keselamatan, kebolehfungsian, dan mesra alam /
    by Fatin Azrin Abd. Rahim
    Published 2017
    Thesis Book
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  2. 2
    Preliminary study of laser solidering on copper substrate /
    by Muhammad Ammar Mohd Dzafir
    Published 2017
    Thesis Book
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  3. 3
    Kesan tenaga gelombang mikro terhadap pembentukan sambungan pateri semasa proses pematerian secara berganda /
    by Rasbudin Ismail
    Published 2017
    Thesis Book
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  4. 4
    Effect of additinal element of nickel (ni) in tin-silver-copper (sn-ag-cu) solders during multiple reflow on intermetallics compound (imc) formation between lead-free solders and electroless nickel immersion silver (enimag) substrate /
    by Mohamad Amirul Asmi Suhadak
    Published 2017
    Thesis Book
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  5. 5
    Welding fundamentals and proceses /
    Published 2011
    Book
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  6. 6
    Soldering in electronics assembly /
    by Judd, Mike
    Published 1999
    Book
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  7. 7
    Metallurgy of welding /
    by Lancaster, J. F.
    Published 1999
    Book
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  8. 8
    Reflow soldering processes : SMT, BGA, CSP AND flip chip technology /
    by Lee, Ning-Cheng
    Published 2002
    Book
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  9. 9
    Quality hand soldering and circuit board repair /
    by Smith, H. Ted
    Published 1997
    Book
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  10. 10
    The handbook of machine soldering : SMT and TH /
    by Woodgate, Ralph W.
    Published 1996
    Book
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  11. 11
    Kajian awal mengenai pembentukan sebatian antara logam dengan menggunakan kaedah pematerian gelombang mikro /
    by Mohamad Faizal Salim
    Published 2015
    Thesis Book
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  12. 12
    Mengkaji kesan kandungan antimoni , SB ke atas pembentukan sebatian antara logam semasa proses pengaliran semula secara berganda /
    by Muhammad Azim Ab Aziz
    Published 2016
    Thesis Book
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  13. 13
    Kesan terhadap kadar penyejukan pengaliran semula secara berganda terhadap pembentukan sebatian antara logam di antara bebola pateri bebas plumbum SAC405 dan enimag /
    by Mohamad Hafiz Abu Bakar
    Published 2016
    Thesis Book
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  14. 14
    Effect of post-reflow cooling rate and isothermal aging on imc formation between Sn-3.0Ag-0.5Cu-0.5Ni lead-free Solders and Enimag /
    by Zolhafizi Jaidi
    Published 2016
    Thesis Book
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  15. 15
    A prelimanary study on joining aluminium to stainless steel gass metal arc welding-cool metal transfer: 'T' joint configuration /
    by Rosela Mohamad Saari
    Published 2010
    Thesis Book
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  16. 16
    Electrical conductive adhesives with nanotechnologies /
    by Li, Yi
    Published 2010
    Book
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  17. 17
    Soldering : understanding the basics /
    Published 2014
    Book
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  18. 18
    Lead free solder : mechanics and reliability /
    by Pang, John Hock Lye
    Published 2012
    Book
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  19. 19
    Soldering in electronics assembly /
    by Judd, Mike
    Published 1999
    Book
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  20. 20
    The basic soldering guide handbook /
    by Winstanley, Alan
    Published 2014
    Book
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