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Showing 1 - 20 results of 34 for search '"Multichip modules (Microelectronics)"', query time: 0.03s Refine Results
  1. 1
    Introduction to multichip modules /
    by Sherwani, Naveed
    Published 1995
    Subjects: “…Multichip modules (Microelectronics).…”
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  2. 2
    Multichip module design, fabrication and testing /
    by Licari, James J.
    Published 1995
    Subjects: “…Multichip modules (Microelectronics ) Design and construction.…”
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  3. 3
    Area array packaging processes : for BGA, flip chip and CSP /
    Published 2004
    Subjects: “…Multichip modules (Microelectronics).…”
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  4. 4
    Area array packaging processes : for BGA, Flip Chip, and CSP /
    Subjects: “…Multichip modules (Microelectronics)…”
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  5. 5
    Multichip module design, fabrication and testing /
    by Licari, James J.
    Published 1995
    Subjects: “…Multichip modules (Microelectronics ) Design and construction. 86542…”
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  6. 6
    Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
    by Lau, John H.
    Published 2000
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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  7. 7
    Introduction to system-on-package (SOP) : miniaturization of the entire system /
    by Tummala, Rao R.
    Published 2008
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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  8. 8
    Flip chip technologies /
    Published 1996
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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  9. 9
    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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  10. 10
    Advanced electronic packaging : with emphasis on multichip modules /
    Published 1998
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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  11. 11
    Advanced electronic packaging : with emphasis on multichip modules /
    Published 1999
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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  12. 12
    Introduction to system-on-package (SOP) miniaturization of the entire system
    by Tummala, Rao R.
    Published 2008
    Subjects: “…Multichip modules (Microelectronics) Design and construction 10432…”
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  13. 13
    Advanced electronic packaging with emphasis on multichip modules
    Published 1999
    Subjects: “…Multichip modules (Microelectronics) Design and construction 10432…”
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  14. 14
    Introduction to system-on-package (SOP) miniaturization of the entire system
    by Tummala, Rao R.
    Published 2008
    Subjects: “…Multichip modules (Microelectronics) Design and construction 10432…”
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  15. 15
    Introduction to system-on-package (SOP) : miniaturization of the entire system /
    by Tummala, Rao R.
    Published 2008
    Subjects: “…Multichip modules (Microelectronics) Design and construction. 86542…”
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  16. 16
    Advanced electronic packaging with emphasis on multichip modules
    Published 1999
    Subjects: “…Multichip modules (Microelectronics) Design and construction 10432…”
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  17. 17
    Advanced electronic packaging : with emphasis on multichip modules /
    Published 1999
    Subjects: “…Multichip modules (Microelectronics) Design and construction. 86542…”
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  18. 18
    Solder joint reliability of BGA, CSP, fine picth SMT assemblies /
    by Lau, John H.
    Published 1997
    Subjects: “…Multichip modules (Microelectronics) Testing.…”
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  19. 19
    Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies
    by Lau, John H
    Published 2000
    Subjects: “…Multichip modules (Microelectronics) Design and construction 10432…”
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  20. 20
    Hybrid assemblies and multichip modules /
    by Kear, Fred W.
    Published 1993
    Subjects: “…Multichip modules (Microelectronics) Design and construction.…”
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