Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint.
Shranjeno v:
| Glavni avtor: | |
|---|---|
| Korporativna značnica: | |
| Format: | Thesis Software eKnjiga |
| Jezik: | English |
| Izdano: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| Teme: | |
| Oznake: |
Označite
Brez oznak, prvi označite!
|
Vzdrževanje sistema
Trenutno vzdržujemo knjižnični informacijski sistem.
Informacije o zalogi so trenutno nedostopne. Opravičujemo se za nevšečnosti in vas prosimo da nas ponovno kontaktirate: