Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /

The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint.

Saved in:
書目詳細資料
主要作者: Nur Syahirah Mohamad Zaimi
企業作者: Universiti Malaysia Perlis
格式: Thesis 軟件 電子書
語言:English
出版: Perlis,Malaysia School of Materials Engineering, Universiti Malaysia Perlis 2017
主題:
標簽: 添加標簽
沒有標簽, 成為第一個標記此記錄!

System Under Maintenance

Our Library Management System is currently under maintenance.

Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance:

david@pintaran.my