Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigat...
Wedi'i Gadw mewn:
| Prif Awdur: | |
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| Awdur Corfforaethol: | |
| Fformat: | Traethawd Ymchwil Meddalwedd eLyfr |
| Iaith: | English |
| Cyhoeddwyd: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
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| Pynciau: | |
| Tagiau: |
Ychwanegu Tag
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
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| Crynodeb: | This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigate the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the intermetallic compounds formation on the copper substrate. To study the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the mechanical properties and thermal properties. |
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| Disgrifiad Corfforoll: | 1 CD-ROM 12 cm. |
| Llyfryddiaeth: | Includes bibliographical references |