Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigat...
Saved in:
| Hovedforfatter: | |
|---|---|
| Institution som forfatter: | |
| Format: | Thesis Software eBog |
| Sprog: | English |
| Udgivet: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| Fag: | |
| Tags: |
Tilføj Tag
Ingen Tags, Vær først til at tagge denne postø!
|
| Summary: | This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigate the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the intermetallic compounds formation on the copper substrate. To study the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the mechanical properties and thermal properties. |
|---|---|
| Fysisk beskrivelse: | 1 CD-ROM 12 cm. |
| Bibliografi: | Includes bibliographical references |