Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigat...
Saved in:
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Thesis Software eBook |
| Language: | English |
| Published: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance: