Mems packaging /

Mems packaging /

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Détails bibliographiques
Collectivité auteur:	Institution of Electrical Engineers
Autres auteurs:	Hsu, Tai-Ran
Format:	Livre
Langue:	English
Publié:	London INSPEC c2004
Sujets:	Microelectromechanical systems Microelectronic packaging. Microelectronics
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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