Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
Saved in:
| 主要作者: | |
|---|---|
| 企業作者: | |
| 格式: | Thesis 圖書 |
| 語言: | English |
| 出版: |
Perlis, Malaysia
School of Materials Engineering
2019
|
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|