Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
Guardat en:
| Autor principal: | |
|---|---|
| Autor corporatiu: | |
| Format: | Thesis Llibre |
| Idioma: | English |
| Publicat: |
Perlis, Malaysia
School of Materials Engineering
2019
|
| Etiquetes: |
Afegir etiqueta
Sense etiquetes, Sigues el primer a etiquetar aquest registre!
|
Sigues el primer a deixar un comentari!