Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
Zapisane w:
| 1. autor: | |
|---|---|
| Korporacja: | |
| Format: | Praca dyplomowa Książka |
| Język: | English |
| Wydane: |
Perlis, Malaysia
School of Materials Engineering
2019
|
| Etykiety: |
Dodaj etykietę
Nie ma etykietki, Dołącz pierwszą etykiete!
|
Napisz pierwszy komentarz!