Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Dades bibliogràfiques
Autor principal:	Gilleo, Ken (Autor)
Format:	Llibre
Idioma:	English
Publicat:	New York McGraw-Hill 2004
Matèries:	Ball grid array technology Microelectronics packaging
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