Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

Αποθηκεύτηκε σε:

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Gilleo, Ken (Συγγραφέας)
Μορφή:	Βιβλίο
Γλώσσα:	English
Έκδοση:	New York McGraw-Hill 2004
Θέματα:	Ball grid array technology Microelectronics packaging
Διαθέσιμο Online:	Click here to view the full text content
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