Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Détails bibliographiques
Auteur principal:	Gilleo, Ken (Auteur)
Format:	Livre
Langue:	English
Publié:	New York McGraw-Hill 2004
Sujets:	Ball grid array technology Microelectronics packaging
Accès en ligne:	Click here to view the full text content
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