Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

में बचाया:

ग्रंथसूची विवरण
मुख्य लेखक:	Gilleo, Ken (लेखक)
स्वरूप:	पुस्तक
भाषा:	English
प्रकाशित:	New York McGraw-Hill 2004
विषय:	Ball grid array technology Microelectronics packaging
ऑनलाइन पहुंच:	Click here to view the full text content
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