Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Bibliografski detalji
Glavni autor:	Gilleo, Ken (Autor)
Format:	Knjiga
Jezik:	English
Izdano:	New York McGraw-Hill 2004
Teme:	Ball grid array technology Microelectronics packaging
Online pristup:	Click here to view the full text content
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