Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Detaylı Bibliyografya
Yazar:	Gilleo, Ken (Yazar)
Materyal Türü:	Kitap
Dil:	English
Baskı/Yayın Bilgisi:	New York McGraw-Hill 2004
Konular:	Ball grid array technology Microelectronics packaging
Online Erişim:	Click here to view the full text content
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