Advanced MEMS packaging

Advanced MEMS packaging

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書目詳細資料
其他作者:	Lau, John H.
格式:	電子書
語言:	English
出版:	New York McGraw-Hill c2010.
主題:	Microelectromechanical systems. Microelectronic packaging.
在線閱讀:	Click here to view the full text content
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