Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Opis bibliograficzny
1. autor:	Tong, Xingcun Colin (Autor)
Korporacja:	SpringerLink (Online service)
Format:	E-book
Język:	English
Wydane:	New York, NY Springer Springer Science+Business Media 2011.
Seria:	Springer Series in Advanced Microelectronics, 30
Hasła przedmiotowe:	Physics Engineering Electronics Optical materials
Dostęp online:	Click here to view the full text content
Etykiety:	Dodaj etykietę Nie ma etykietki, Dołącz pierwszą etykiete!

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