Advanced materials for therma management of electronic packaging
Saved in:
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer Springer Science+Business Media
2011.
|
| Series: | Springer Series in Advanced Microelectronics,
30 |
| Subjects: | |
| Online Access: | Click here to view the full text content |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|