Advanced materials for therma management of electronic packaging
Gorde:
Egile nagusia: | Tong, Xingcun Colin (Egilea) |
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Erakunde egilea: | SpringerLink (Online service) |
Formatua: | eBook |
Hizkuntza: | English |
Argitaratua: |
New York, NY
Springer Springer Science+Business Media
2011.
|
Saila: | Springer Series in Advanced Microelectronics,
30 |
Gaiak: | |
Sarrera elektronikoa: | Click here to view the full text content |
Etiketak: |
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