Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Detaylı Bibliyografya
Yazar:	Tong, Xingcun Colin (Yazar)
Müşterek Yazar:	SpringerLink (Online service)
Materyal Türü:	Ekitap
Dil:	English
Baskı/Yayın Bilgisi:	New York, NY Springer Springer Science+Business Media 2011.
Seri Bilgileri:	Springer Series in Advanced Microelectronics, 30
Konular:	Physics Engineering Electronics Optical materials
Online Erişim:	Click here to view the full text content
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!

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