Electromigration modeling at circuit layout level /
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has...
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Main Author: | Tan, Cher Ming (Author) |
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Corporate Author: | SpringerLink (Online service) |
Other Authors: | He, Feifei |
Format: | eBook |
Language: | English |
Published: |
Singapore
Springer Singapore
2013.
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Series: | SpringerBriefs in Applied Sciences and Technology
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Subjects: | |
Online Access: | Click here to view the full text content |
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