Electromigration modeling at circuit layout level /

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...

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Bibliographic Details
Main Author: Tan, Cher Ming (Author)
Corporate Author: SpringerLink (Online service)
Other Authors: He, Feifei
Format: eBook
Language:English
Published: Singapore Springer Singapore 2013.
Series:SpringerBriefs in Applied Sciences and Technology
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Online Access:Click here to view the full text content
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