Arbitrary Modeling of TSVs for 3D Integrated Circuits
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects. Readers will benefit from in-depth...
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| Main Authors: | , , |
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Cham :
Springer International Publishing : Imprint: Springer,
2015.
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| Series: | Analog Circuits and Signal Processing,
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| Subjects: | |
| Online Access: | Click here to view the full text content |
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