Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth...

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Bibliographic Details
Main Authors: Salah, Khaled (Author), Ismail, Yehea (Author), El-Rouby, Alaa (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2015.
Series:Analog Circuits and Signal Processing,
Subjects:
Engineering.
Microprocessors.
Electronics.
Microelectronics.
Electronic circuits.
Online Access:Click here to view the full text content
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Table of Contents:
  • Introduction: Work around Moore's Law
  • 3D/TSV Enabling Technologies
  • TSV Modeling and Analysis
  • TSV Verification
  • TSV Macro-Modeling Framework
  • TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter
  • Imperfection in TSV Modeling
  • New Trends in TSV
  • TSV Fabrication
  • Conclusions.

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