Hot air solder levelling (HASL) process parameters optimization for SN100CL /
In this study, the coating thickness that is required for a good solderability will be conducted using Gen3 wetting balance test. In phase I of study, initial coating process optimization of coating dipping time using copper strips with dimension of 10 mm (length) X 3 mm (width) X 0.3 mm (thickness)...
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| Formato: | Thesis Software livro electrónico |
| Idioma: | English |
| Publicado em: |
Perlis, Malaysia
School of Materials Engineering
2016
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