Hot air solder levelling (HASL) process parameters optimization for SN100CL /
In this study, the coating thickness that is required for a good solderability will be conducted using Gen3 wetting balance test. In phase I of study, initial coating process optimization of coating dipping time using copper strips with dimension of 10 mm (length) X 3 mm (width) X 0.3 mm (thickness)...
Shranjeno v:
| Glavni avtor: | |
|---|---|
| Korporativna značnica: | |
| Format: | Thesis Software eKnjiga |
| Jezik: | English |
| Izdano: |
Perlis, Malaysia
School of Materials Engineering
2016
|
| Teme: | |
| Oznake: |
Označite
Brez oznak, prvi označite!
|
Search Result 1
