Sayyidah Amnah Musa. (2016). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. School of Materials Engineering.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. Perlis, Malaysia: School of Materials Engineering, 2016.
توثيق جمعية اللغة المعاصرة MLA (الطبعة الثامنة)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. School of Materials Engineering, 2016.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.