Sayyidah Amnah Musa. (2016). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. School of Materials Engineering.
Cita Chicago (17th ed.)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. Perlis, Malaysia: School of Materials Engineering, 2016.
Cita MLA (8th ed.)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. School of Materials Engineering, 2016.
Atenció: Aquestes cites poden no estar 100% correctes.