Sayyidah Amnah Musa. (2016). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. School of Materials Engineering.
Chicago Style (17th ed.) CitationSayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. Perlis, Malaysia: School of Materials Engineering, 2016.
MLA (8th ed.) CitationSayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. School of Materials Engineering, 2016.
Warning: These citations may not always be 100% accurate.