Sayyidah Amnah Musa. (2016). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. School of Materials Engineering.
Lua i Stíl Chicago (17ú heag.)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. Perlis, Malaysia: School of Materials Engineering, 2016.
Lua MLA (8ú heag.)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. School of Materials Engineering, 2016.
Rabhadh: Seans nach mbeach na luanna seo go hiomlán cruinn i ngach uile chás.