Sayyidah Amnah Musa. (2016). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. School of Materials Engineering.
Chicago-referens (17:e uppl.)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. Perlis, Malaysia: School of Materials Engineering, 2016.
MLA-referens (8:e uppl.)Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. School of Materials Engineering, 2016.
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