Sayyidah Amnah Musa. (2016). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. School of Materials Engineering.
芝加哥风格引文Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. Perlis, Malaysia: School of Materials Engineering, 2016.
MLA引文Sayyidah Amnah Musa. Development of Sn-Cu Filled Activated Carbon Composite Solder via Powder Metallurgy Technique. School of Materials Engineering, 2016.
警告：这些引文格式不一定是100％准确.