Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

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In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...

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Detalles Bibliográficos
Autor Principal: Sayyidah Amnah Musa (Author)
Autor Corporativo: Universiti Malaysia Perlis
Formato: Thesis Software eBook
Idioma:English
Publicado: Perlis, Malaysia School of Materials Engineering 2016
Subjects:
Solder and soldering
Carbon composites
Tin
Copper
Powder metallurgy
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