Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

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In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...

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書誌詳細
第一著者:	Sayyidah Amnah Musa (著者)
団体著者:	Universiti Malaysia Perlis
フォーマット:	学位論文ソフトウェア eBook
言語:	English
出版事項:	Perlis, Malaysia School of Materials Engineering 2016
主題:	Solder and soldering Carbon composites Tin Copper Powder metallurgy
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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