Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

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In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...

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Библиографические подробности
Главный автор:	Sayyidah Amnah Musa (Автор)
Соавтор:	Universiti Malaysia Perlis
Формат:	Диссертация Программное обеспечение eКнига
Язык:	English
Опубликовано:	Perlis, Malaysia School of Materials Engineering 2016
Предметы:	Solder and soldering Carbon composites Tin Copper Powder metallurgy
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

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