Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /
In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...
Sparad:
Huvudupphovsman: | Sayyidah Amnah Musa (Författare, medförfattare) |
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Institutionell upphovsman: | Universiti Malaysia Perlis |
Materialtyp: | Lärdomsprov Datorprogram E-bok |
Språk: | English |
Publicerad: |
Perlis, Malaysia
School of Materials Engineering
2016
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