Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

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In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...

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Détails bibliographiques
Auteur principal:	Sayyidah Amnah Musa (Auteur)
Collectivité auteur:	Universiti Malaysia Perlis
Format:	Thèse Logiciel eBook
Langue:	English
Publié:	Perlis, Malaysia School of Materials Engineering 2016
Sujets:	Solder and soldering Carbon composites Tin Copper Powder metallurgy
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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