Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /
In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...
Saved in:
| 主要作者: | |
|---|---|
| 企业作者: | |
| 格式: | Thesis 软件 电子书 |
| 语言: | English |
| 出版: |
Perlis, Malaysia
School of Materials Engineering
2016
|
| 主题: | |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|
成为第一个发表评论!