Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /
In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...
Saved in:
| Hovedforfatter: | |
|---|---|
| Institution som forfatter: | |
| Format: | Thesis Software eBog |
| Sprog: | English |
| Udgivet: |
Perlis, Malaysia
School of Materials Engineering
2016
|
| Fag: | |
| Tags: |
Tilføj Tag
Ingen Tags, Vær først til at tagge denne postø!
|
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance: