Hot air solder levelling (HASL) process parameters optimization for SN100CL /
In this study, the coating thickness that is required for a good solderability will be conducted using Gen3 wetting balance test. In phase I of study, initial coating process optimization of coating dipping time using copper strips with dimension of 10 mm (length) X 3 mm (width) X 0.3 mm (thickness)...
Saved in:
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Thesis Book |
| Language: | English |
| Published: |
Perlis, Malaysia
School of Materials Engineering
2016
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance: