Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Dades bibliogràfiques
Autor principal:	Muhammad Nubli Bin Zulkifli (Autor)
Autor corporatiu:	Universiti Malaysia Perlis
Format:	Thesis Llibre
Idioma:	English
Publicat:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Matèries:	Ball grid array technology Chip scale packaging
Etiquetes:	Afegir etiqueta Sense etiquetes, Sigues el primer a etiquetar aquest registre!

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